JPS629730Y2 - - Google Patents
Info
- Publication number
- JPS629730Y2 JPS629730Y2 JP11800882U JP11800882U JPS629730Y2 JP S629730 Y2 JPS629730 Y2 JP S629730Y2 JP 11800882 U JP11800882 U JP 11800882U JP 11800882 U JP11800882 U JP 11800882U JP S629730 Y2 JPS629730 Y2 JP S629730Y2
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- integrated circuit
- hybrid integrated
- sealing lid
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 25
- 238000002955 isolation Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004840 adhesive resin Substances 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11800882U JPS5923744U (ja) | 1982-08-02 | 1982-08-02 | 混成集積回路の封止構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11800882U JPS5923744U (ja) | 1982-08-02 | 1982-08-02 | 混成集積回路の封止構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5923744U JPS5923744U (ja) | 1984-02-14 |
| JPS629730Y2 true JPS629730Y2 (en]) | 1987-03-06 |
Family
ID=30271420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11800882U Granted JPS5923744U (ja) | 1982-08-02 | 1982-08-02 | 混成集積回路の封止構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5923744U (en]) |
-
1982
- 1982-08-02 JP JP11800882U patent/JPS5923744U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5923744U (ja) | 1984-02-14 |
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